The assembly of an electronic board is an articulated activity in constant evolution, which generates more problems as circuits become smaller and the  process becomes more complex.
The constant monitoring of each step of the manufacturing process phase ensures a constant level of quality and reduces the overall costs of the product.
From the solder paste printing process, to the component placement process up to the reflow process, defects are created which must be intercepted using modern optical inspection systems, based on cameras or x-ray.
Visual inspections executed by an operator do not allow an objective and constant standard and merely identify the most evident faults, without exercising true process verification.
Automatic Optical Inspection (AOI) systems introduce a powerful filter with which to monitor process stability, to perform  regular, automatic data collection and the ability to stop the line immediately in case of deviation from the expected quality.
 

Through its partnership with Omron, Seica is able to offer several  process control solutions:
- 3D paste inspection (AOI line)
- pre-reflow process inspection (AOI line)
- post-reflow process inspection (AOI line)
-  X-ray BGA inspection (AOI line)